Determining pattern ranking based on measurement feedback from printed substrate
US12038694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2023 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Mar 7, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70675
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods for training a process model and determining ranking of simulated patterns (e.g., corresponding to hot spots). A method involves obtaining a training data set including: (i) a simulated pattern associated with a mask pattern to be printed on a substrate, (ii) inspection data of a printed pattern imaged on the substrate using the mask pattern, and (iii) measured values of a parameter of the patterning process applied during imaging of the mask pattern on the substrate; and training a machine learning model for the patterning process based on the training data set to predict a difference in a characteristic of the simulated pattern and the printed pattern. The trained machine learning model can be used for determining a ranking of hot spots. In another method a model is trained based on measurement data to predict ranking of the hot spots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.