Collaborative learning model for semiconductor applications

US12038802B2 · kind B2 · utility

Assignee

• PDF SOLUTIONS, INC. · US

Inventors

• Tomonori Honda · Santa Clara, US
• Richard Burch · McKinney, US
• John Kibarian · Los Altos Hills, US
• Lin Lee Cheong · San Jose, US
• Qing Zhu · Rowlett, US
• Vaishnavi Reddipalli · San Jose, US
• Kenneth R. Harris · Byfield, US
• Said Akar · Miami, US
• Jeffrey Drue David · San Jose, US
• Michael Keleher · Lockport, US
• Brian E. Stine · Los Altos Hills, US
• Dennis Ciplickas · San Jose, US

Key dates

• Filing date: Oct 14, 2020
• Grant date: Jul 16, 2024
• Expiry date: Feb 9, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G06N7/01
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.