Modulated atomic layer deposition
US12040181B2 · kind B2 · utility
2Cited by
201References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2019 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Dec 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for depositing thin films using long and short conversion times during alternating cycles of atomic layer deposition (ALD) are provided herein. Embodiments involve alternating conversion duration of an ALD cycle in one or more cycles of a multi-cycle ALD process. Some embodiments involve modulation of dose, purge, pressure, plasma power or plasma energy in two or more ALD cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.