Radio frequency packages containing multilevel power substrates and associated fabrication methods
US12040291B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jul 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.