Method and apparatus for treating substrate
US12046466B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 14, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Oct 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.