Flow-through, hot-spot-targeting immersion cooling assembly
US12048118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Mar 24, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooling assembly comprises at least one primary heat-generating electronic component and a flow-through cooling module mounted near the at least one primary heat-generating component. The flow-through cooling module comprises at least one inlet conduit to accept an inflow of pressurized dielectric coolant, a fluid chamber through which fluid flows to provide targeted, direct cooling to a heat-generating component, and exit passageways to facilitate flow-through of the dielectric coolant into a surrounding immersion bath for cooling of other components. As it flows out of the cooling module and over the heat-generating component, the coolant fluid absorbs heat from the heat-generating electronic component. In certain embodiments, the assembly may also comprise at least one periphery heat-generating electronic component, which may also be cooled by the dielectric coolant as it exits the vicinity of the flow-through cooling module. The cooling module may include impingement nozzles to accelerate and direct the flow of coolant fluid toward the high-heat-generating electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.