Package structure and method of forming the same
US12051672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2020 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | May 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a method of forming a package structure, and the method includes: bonding a die to a wafer; performing a thinning process on the die, wherein the die has a first total thickness variation (TTV) after performing the thinning process; forming a dielectric layer on the wafer to cover sidewalls and a top surface the die; performing a first removal process to remove a first portion of the dielectric layer and expose the top surface of the die; and performing a second removal process to remove a second portion of the dielectric layer and a portion of the die, wherein after performing the second removal process, the die has a second TTV less than the first TTV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.