Face-to-face semiconductor device with fan-out porch
US12051684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2023 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor device assemblies can include a substrate having a substrate contact. The assemblies can include a first semiconductor device and a second semiconductor device arranged in a face-to-face configuration. The assemblies can include a fan-out porch on the substrate at a lateral side of the first semiconductor device and including a wirebond contact, the wirebond contact being electrically coupled to the first semiconductor device. The assemblies can include a wirebond operably coupling the wirebond contact to the substrate contact. The assemblies can include a pillar or bump operably coupling the active side of the first semiconductor device to the active side of the second semiconductor device. In some embodiments, the wirebond contact is operably couple to the active side of the first semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.