Conductive film adhesive
US12053934B2 · kind B2 · utility
0Cited by
38References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2020 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Dec 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.