Substrate processing method and substrate processing apparatus
US12054828B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Dec 16, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Dec 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing method includes supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector, which extends in a vertical direction along an inner wall surface of a processing container and is rotatable around a rotational axis extending in the vertical direction, to perform a predetermined process on a substrate accommodated in the processing container. The predetermined process includes a plurality of operations, and a supply direction of the processing gas is changed by rotating the injector in accordance with the operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.