Acidic aqueous composition for electrolytically depositing a copper deposit

US12054843B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Ralf Schmidt · Berlin, DE
• Josef Gaida · Berlin, DE
• Willi Rohland · Berlin, DE
• Jens Palm · Berlin, DE
• Himendra Jha · Berlin, DE

Key dates

• Filing date: Apr 22, 2021
• Grant date: Aug 6, 2024
• Expiry date: Apr 22, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C07D251/54
• WIPO field: Organic fine chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising