Cleaning jig, substrate treating apparatus including the same, cleaning method of substrate treating apparatus
US12055866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2209/08
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to a substrate treating apparatus, and may include a substrate treating apparatus includes a rotatable spin head, a cup that surrounds the spin head, a cleaning jig seated on the spin head, and that discharges a cleaning liquid toward the cup through rotation of the spin head, and a nozzle unit located at an upper portion of the cleaning jig and that supplies the cleaning liquid to a center of an upper surface of the cleaning jig, and the cleaning jig includes spattering guide grooves formed to be recessed such that the cleaning liquid provided from the nozzle unit spatters toward the cup with a centrifugal force due to the rotation of the spin head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.