Patent · US Active

Wafer-tilt determination for slice-and-image process

US12056865B2 · kind B2 · utility

0Cited by

1References

25Claims

0Family size

Assignee

Carl Zeiss SMT GmbH · DE

Inventors

Dmitry Klochkov · Hinterhochstett, DE
Chuong Huynh · Quincy, US
Thomas Korb · Schwäbisch Gmünd, DE

Key dates

Filing date	Oct 7, 2021
Grant date	Aug 6, 2024
Priority date	—
Expiry date	Dec 22, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/31745
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.