Patent · US Active

Package formation methods including coupling a molded routing layer to an integrated routing layer

US12057364B2 · kind B2 · utility

0Cited by

13References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Lizabeth Keser · Chandler, US
Thomas Ort · Veitsbronn, DE
Thomas Wagner · Regelsbach, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Nov 21, 2022
Grant date	Aug 6, 2024
Priority date	—
Expiry date	Nov 21, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and method is disclosed. Devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. Devices shown further included a molded routing layer coupled to the integrated routing layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.