Semiconductor package and manufacturing method thereof
US12057434B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Nov 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.