Inventor · Seoul, KR

Jae Ung Lee

19Patents

5h-index

33Co-inventors

62Inventor score

Filing activity: Feb 24, 2011 → Feb 6, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8873272B2	Semiconductor memory apparatus and test circuit therefor	Physics	407	Active
US9935083B2	Semiconductor package and manufacturing method thereof	Electricity	14	Active
US10163867B2	Semiconductor package and manufacturing method thereof	Electricity	12	Active
US8921955B1	Semiconductor device with micro electromechanical system die	Electricity	10	Active
US10872879B2	Semiconductor package and manufacturing method thereof	Electricity	5	Active
US10032705B2	Semiconductor package and manufacturing method thereof	Electricity	5	Active
US11488934B2	Semiconductor package and manufacturing method thereof	Electricity	3	Active
US9018741B2	Semiconductor package and manufacturing method thereof	Electricity	1	Active
US9809446B1	Semiconductor package and manufacturing method thereof	Electricity	1	Active
US9513254B2	Microfluidic sensor package structure and method	Emerging Cross-Sectional Technologies	0	Active
US12057434B2	Semiconductor package and manufacturing method thereof	Electricity	0	Active
US11855000B2	Semiconductor device having EMI shielding structure and related methods	Electricity	0	Active
US11355449B2	Semiconductor device having EMI shielding structure and related methods	Electricity	0	Active
US10144634B2	Semiconductor package and manufacturing method thereof	Electricity	0	Active
US12009289B2	Semiconductor package and manufacturing method thereof	Electricity	0	Active
US11152296B2	Semiconductor package and manufacturing method thereof	Electricity	0	Active
US10822226B2	Semiconductor package using a polymer substrate	Electricity	0	Active
US11572269B2	Semiconductor package using a polymer substrate	Electricity	0	Active
US12187603B2	Semiconductor package using a polymer substrate	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.