Robert Lanzone
10Patents
4h-index
15Co-inventors
53Inventor score
Filing activity: Mar 23, 2010 → Oct 31, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10163867B2 | Semiconductor package and manufacturing method thereof | Electricity | 12 | Active |
| US8564114B1 | Semiconductor package thermal tape window frame for heat sink attachment | Electricity | 12 | Active |
| US8552557B1 | Electronic component package fabrication method and structure | Electricity | 5 | Active |
| US10872879B2 | Semiconductor package and manufacturing method thereof | Electricity | 5 | Active |
| US9875980B2 | Copper pillar sidewall protection | Electricity | 4 | Active |
| US8664090B1 | Electronic component package fabrication method | Electricity | 4 | Active |
| US9245862B1 | Electronic component package fabrication method and structure | Electricity | 4 | Active |
| US11488934B2 | Semiconductor package and manufacturing method thereof | Electricity | 3 | Active |
| US8969192B1 | Low stress substrate and formation method | Electricity | 0 | Active |
| US12057434B2 | Semiconductor package and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.