Method for fast loading substrates in a flat panel tool
US12061422B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1303
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.