Method of manufacturing semiconductors using fluid delivery system
US12062553B2 · kind B2 · utility
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16References
20Claims
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Key dates
| Filing date | Oct 6, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Jun 6, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/5283
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.