Systems and methods for substrate support temperature control
US12062567B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 9, 2020 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Jul 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.