Package structure and manufacturing method of the same
US12062742B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2022 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Apr 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.