Methods of environmental protection for silicon MEMS structures in cavity packages
US12063474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2022 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Nov 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2307/025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.