Mark Pavier
51Patents
11h-index
55Co-inventors
81Inventor score
Filing activity: Feb 24, 2000 → Apr 22, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6593622B2 | Power mosfet with integrated drivers in a common package | Electricity | 59 | Expired |
| US7227198B2 | Half-bridge package | Electricity | 41 | Expired |
| US7745930B2 | Semiconductor device packages with substrates for redistributing semiconductor device electrodes | Electricity | 24 | Active |
| US7547964B2 | Device packages having a III-nitride based power semiconductor device | Electricity | 18 | Active |
| US6717260B2 | Clip-type lead frame for source mounted die | Electricity | 16 | Expired |
| US6838735B1 | Trench FET with non overlapping poly and remote contact therefor | Electricity | 16 | Expired |
| US7250672B2 | Dual semiconductor die package with reverse lead form | Electricity | 15 | Expired |
| US7095099B2 | Low profile package having multiple die | Electricity | 14 | Expired |
| US6858922B2 | Back-to-back connected power semiconductor device package | Electricity | 13 | Expired |
| US7345563B2 | Embedded inductor for semiconductor device circuit | Electricity | 12 | Active |
| US6891739B2 | H-bridge with power switches and control in a single package | Electricity | 11 | Expired |
| US7678609B2 | Semiconductor package with redistributed pads | Emerging Cross-Sectional Technologies | 8 | Active |
| US9159703B2 | Power converter package including vertically stacked driver IC | Electricity | 8 | Active |
| US7671455B2 | Semiconductor device package with integrated heat spreader | Electricity | 8 | Active |
| US7034344B2 | Integrated semiconductor power device for multiple battery systems | Electricity | 7 | Expired |
| US7402507B2 | Semiconductor package fabrication | Electricity | 7 | Expired |
| US10074590B1 | Molded package with chip carrier comprising brazed electrically conductive layers | Electricity | 5 | Active |
| US7274100B2 | Battery protection circuit with integrated passive components | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8089147B2 | IMS formed as can for semiconductor housing | Electricity | 4 | Active |
| US6723620B1 | Power semiconductor die attach process using conductive adhesive film | Electricity | 4 | Expired |
| US6894397B2 | Plural semiconductor devices in monolithic flip chip | Electricity | 4 | Expired |
| US7235877B2 | Redistributed solder pads using etched lead frame | Electricity | 3 | Expired |
| US8143729B2 | Autoclave capable chip-scale package | Electricity | 3 | Active |
| US6924175B2 | Clip-type lead frame for source mounted die | Electricity | 3 | Expired |
| US8390131B2 | Semiconductor device with reduced contact resistance | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.