Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine
US12063745B2 · kind B2 · utility
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8References
13Claims
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Key dates
| Filing date | May 3, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Sep 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0812
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.