Patent · US Active

Rapid thermal processing system with cooling system

US12068177B2 · kind B2 · utility

1Cited by

1References

11Claims

0Family size

Assignees

Beijing E-Town Semiconductor Technology Co., Ltd. · CN
Mattson Technology, Inc. · US

Inventors

Manuel Sohn · Neu-Ulm, DE
Rolf Bremensdorfer · Bibertal, DE
Silke Hamm · Laupheim, DE
Dieter Hezler · Lonsee, DE

Key dates

Filing date	Aug 18, 2021
Grant date	Aug 20, 2024
Priority date	—
Expiry date	Nov 20, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67248
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.