Patent · US Active

Acidic aqueous composition for electrolytic copper plating

US12071702B2 · kind B2 · utility

0Cited by

11References

2Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Kun SI · Berlin, DE
Ralf Schmidt · Berlin, DE
Onas Bolton · Dearborn, US
Josef Gaida · Berlin, DE
Frank Von Horsten · Berlin, DE
Dirk Rohde · Berlin, DE
Himendra Jha · Berlin, DE
Jens Palm · Berlin, DE
Olivier Mann · Berlin, DE
Angela Llavona-Serrano · Berlin, DE

Key dates

Filing date	May 10, 2021
Grant date	Aug 27, 2024
Priority date	—
Expiry date	Mar 28, 2043

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D7/123
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.