Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
US12080609B2 · kind B2 · utility
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12References
20Claims
0Family size
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Key dates
| Filing date | Nov 23, 2020 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Jan 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a method of detecting photoresist scums and photoresist residues. A carrier is provided. The carrier has a photoresist layer with opening patterns therein. A plasma etching process is performed to the opening patterns of the photoresist layer. Charges are injected to the opening patterns of the photoresist layer. Whether a photoresist scum or residue is present in at least one of the opening patterns is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.