Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon

US12083705B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Axel Beyer · Munich, DE
• Stefan WELSCH · Polling, DE

Key dates

• Filing date: Dec 12, 2019
• Grant date: Sep 10, 2024
• Expiry date: Jun 3, 2041

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

Semiconductor wafers are produced from a workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires tensioned between wire guide rollers and divided into wire groups, the wires moving in a running direction producing kerfs as wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups determined, and for each of the wire groups compensating movements of the wires of the wire group are induced as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element.