Mold compound dispensing system and method
US12083715B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 2, 2021 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Nov 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06586
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.