Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
US12084599B2 · kind B2 · utility
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4References
7Claims
0Family size
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Key dates
| Filing date | Oct 18, 2023 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Oct 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.