Emi MIYAZAWA
4Patents
1h-index
12Co-inventors
41Inventor score
Filing activity: Mar 3, 2011 → Oct 18, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9431314B2 | Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device | Electricity | 2 | Active |
| US12165882B2 | Semiconductor device manufacturing method | Electricity | 0 | Active |
| US12084599B2 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Electricity | 0 | Active |
| US11840648B2 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.