Thermal control wafer with integrated heating-sensing elements
US12085609B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2023 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Aug 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein are systems and methods comprising a thermal control wafer (TCW) comprising a plurality of heater zones. A heater zone may comprise a heater-sensing element that generates heat during a heating mode and provides a resistance during a sensing mode. During testing, a wafer under test (WUT) may be placed on top of a chuck assembly. The TCW may be part of or separate from the chuck assembly. Controlling one or more heater zones on the TCW may control the temperatures of DUT(s) while being tested. The thermal controller may comprise a plurality of thermal control channel multiplexed to a plurality of heater zones. E.g., one or more first heater zones can be activated at a first time, one or more second heater zones can be activated at a second time, one or more third heater zones can be activated at a third time, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.