Hierarchical power management apparatus and method

US12093100B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Vivek Garg · San Mateo, US
• Ankush Varma · Portland, US
• Krishnakanth V. Sistla · Beaverton, US
• Nikhil Gupta · Portland, US
• Nikethan Shivanand Baligar · Hillsboro, US
• Stephen Wang · Grand Blanc, US
• Nilanjan PALIT · Northborough, US
• Timothy Y. Kam · Portland, US
• Adwait Purandare · Hillsboro, US
• Ujjwal Gupta · Hillsboro, US
• Stanley Chen · Mountain View, US
• Dorit Shapira · Atlit, IL
• Shruthi VENUGOPAL · Hillsboro, US
• Suresh Chemudupati · Austin, US
• Rupal Parikh · Hillsboro, US
• Eric J. Dehaemer · Shrewsbury, US
• Pavithra Sampath · Shrewsbury, US
• Phani Kumar Kandula · Bengaluru, IN
• Yogesh Bansal · Sammamish, US
• Dean Mulla · San Jose, US
• Michael Tulanowski · Fort Collins, US
• Stephen Paul Haake · Sunnyvale, US
• Andrew J. Herdrich · Hillsboro, US
• Ripan Das · Beaverton, US
• Nazar Haider · Fremont, US
• Aman Sewani · Sunnyvale, US

Key dates

• Filing date: Sep 26, 2020
• Grant date: Sep 17, 2024
• Expiry date: Oct 17, 2042

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02D10/00
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.