Methods for filling a gap and related systems and devices
US12094769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Aug 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and related systems for filling a gap feature comprised in a substrate are disclosed. The methods comprise a step of providing a substrate comprising one or more gap features into a reaction chamber. The one or more gap features comprise an upper part comprising an upper surface and a lower part comprising a lower surface. The methods further comprise a step of subjecting the substrate to a first plasma treatment and subjecting the substrate to a second plasma treatment. Thus the upper surface is inhibited while leaving the lower surface substantially unaffected. Then, the methods comprise a step of selectively depositing a material on the lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.