Substrate processing method
US12100578B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Feb 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing method includes forming a pre-coat film on an in-chamber part disposed in a chamber, and subsequently processing one or more substrates. The forming a pre-coat film includes forming a first film on the in-chamber part without using plasma or by using a first plasma generated under a condition that sputtering is suppressed on the in-chamber part, and forming a second film on a surface of the first film by using a second plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.