Patent · US Active

Deposition ring for thin substrate handling via edge clamping

US12100579B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Abhishek Chowdhury · Kanchinakote, IN
Edwin C. Suarez · Pleasanton, US
Harisha Sathyanarayana · Kanchinakote, IN
Nataraj Bhaskar Rao · Kanchinakote, IN
Siqing Lu · Sunnyvale, US

Key dates

Filing date	Nov 18, 2020
Grant date	Sep 24, 2024
Priority date	—
Expiry date	Mar 29, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.