Thermal management of electronics using co-located microjet nozzles and electronic elements
US12100643B2 · kind B2 · utility
1Cited by
94References
10Claims
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Key dates
| Filing date | May 13, 2020 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Aug 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4336
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics assembly in which microjet nozzles are co-located with electronic elements on the same substrate or layer. This technique may be used to integrate lower power-density electronics onto an existing microjet nozzle plate to perform microjet nozzle cooling, which removes the need for separate thermal management solutions for systems that contain both high and lower power-density elements in proximity. This technique may also be used in multilayered 3D integrated electronic substrates, allowing for thin, high performing thermal management solutions in 3D integrated stackups using microjets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.