Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
US12104856B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 18, 2017 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jan 22, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P15/26
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.