Thermally enhanced FCBGA package
US12107028B2 · kind B2 · utility
0Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2023 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Apr 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a heat spreader with an opening formed through the heat spreader. The heat spreader is disposed over a substrate with a semiconductor die disposed on the substrate in the opening. A thermally conductive material, e.g., adhesive or an elastomer plug, is disposed in the opening between the heat spreader and semiconductor die. A conductive layer is formed over the substrate, heat spreader, and thermally conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.