Semiconductor device package and the method of manufacturing the same
US12107056B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jun 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.