Hybrid structure for a surface acoustic wave device
US12108678B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jan 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/708
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a hybrid structure for a surface-acoustic-wave device comprising a useful layer of piezoelectric material joined to a carrier substrate having a thermal expansion coefficient lower than that of the useful layer; the hybrid structure comprising an intermediate layer located between the useful layer and the carrier substrate, the intermediate layer being a structured layer formed from at least two different materials comprising a plurality of periodic motifs in the plane of the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.