Surface mount technology method and magnetic carrier system
US12114435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Jan 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/104
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.