Lead-free solder compositions

US12115602B2 · kind B2 · utility

Assignee

• ALPHA ASSEMBLY SOLUTIONS INC. · US

Inventors

• Ranjit Pandher · South Plainfield, US
• Niveditha NAGARAJAN · Waterbury, US
• Anil Kumar · Bengaluru, IN
• Morgana De Avila Ribas · Bengaluru, IN
• Gyan Dutt · Waterbury, US
• Siuli Sarkar · South Plainfield, US
• Carl J. Bilgrien · Midland, US

Key dates

• Filing date: Dec 26, 2019
• Grant date: Oct 15, 2024
• Expiry date: Feb 18, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C22C13/02
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.