Method of wafer alignment using at resolution metrology on product features
US12124179B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | May 11, 2021 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Jun 11, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7088
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.