Patent · US Active

Semiconductor substrate support leveling apparatus

US12131934B2 · kind B2 · utility

0Cited by

4References

7Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Katherine Woo · Santa Clara, US
Paul Brillhart · Pleasanton, US
Jian Li · Fremont, US
Shinnosuke Kawaguchi · Adachi, JP
David W. Groechel · Los Altos Hills, US
Dorothea Buechel-Rimmel · San Jose, US
Juan Carlos Rocha-Alvarez · Redwood City, US
Paul Fisher · Brighton, US
Chidambara A. Ramalingam · Fremont, US
Joseph J. Farah · Hollister, US

Key dates

Filing date	Oct 5, 2020
Grant date	Oct 29, 2024
Priority date	—
Expiry date	May 19, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH04Q2209/40
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.