Patent · US Active

Electronic systems with inverted circuit board with heat sink to chassis attachment

US12131977B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Barrett M. Faneuf · Lakewood, US
Phil Geng · Washougal, US
Kenan Arik · Hillsboro, US
David Shia · Portland, US
Casey Winkel · Tumwater, US
Sandeep Ahuja · University Place, US
Eric D. McAfee · Portland, US
Jeffory L. Smalley · East Olympia, US
Minh T. D. Le · North Plains, US
Ralph V. Miele · Hillsboro, US
Marc Milobinski · Scappoose, US
Aaron P. Anderson · Beaverton, US
Brendan T. Pavelek · Portland, US
Carlos Alvizo Flores · Guadalajara, MX
Fernando Gonzalez Lenero · Zapopan, MX

Key dates

Filing date	Oct 31, 2023
Grant date	Oct 29, 2024
Priority date	—
Expiry date	Oct 31, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2023/4087
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.