Method for treating substrate and apparatus for treating substrate
US12142492B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Sep 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3344
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.