Dong Sub Oh
6Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Oct 21, 2019 → Aug 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11148150B2 | Liquid dispensing nozzle and substrate treating apparatus | Performing Operations; Transporting | 11 | Active |
| US12308219B2 | Substrate treating method and substrate treating apparatus | Electricity | 0 | Active |
| US12142492B2 | Method for treating substrate and apparatus for treating substrate | Electricity | 0 | Active |
| US12146710B2 | Substrate treating apparatus and substrate treating system comprising the same | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US12237151B2 | Apparatus and method for processing substrate using plasma | Electricity | 0 | Active |
| US12327735B2 | Apparatus and method for processing substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.