Substrate processing apparatus and substrate processing method
US12142496B2 · kind B2 · utility
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1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Apr 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.