Substrate treating apparatus and substrate treating system comprising the same
US12146710B2 · kind B2 · utility
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3References
19Claims
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Key dates
| Filing date | Jul 2, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27B2009/026
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A substrate treating apparatus and a substrate treating system including the same are disclosed, in which the number of heat treatment chambers such as anneal chambers may be varied. The substrate treating apparatus includes a first chamber heat-treating a substrate; and a second chamber treating the substrate in another way different from heat-treatment, wherein the number of the first chambers is varied depending on the number of the second chambers that need heat treatment for the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.